Managing cooling devices and computing nodes in an infrastructure

Joint optimization of workload placement and data center cooling by minimizing an economic cost function combining computational and thermal network models against real-time energy prices.

Inventors

Luca Parolini, Niraj Tolia, Bruno Sinopoli, Bruce H. Krogh

Patent no.

US8539059B2

Assignee

Hewlett-Packard Development Company, L.P.

Abstract

A system for managing computing nodes and cooling devices in a data center infrastructure jointly optimizes workload placement and cooling control. When a service request arrives, candidate placements are evaluated using both a computational network model (compute cost) and a thermal network model (cooling cost), and the placement minimizing total economic cost — accounting for energy price schedules and SLA constraints — is selected.

Filings

Jurisdiction	Kind	Application / Publication no.	Date
US	Application	US12/792,400	2010-06-02
US	Grant	US8539059B2	2013-09-17

Figures

Dual-layer network model: candidate workload placements (top, computational network) are linked to their corresponding cooling cost in the thermal network (bottom), enabling joint optimization across both layers.

Related

• paper A cyber-physical systems approach to energy management in data centers · ACM/IEEE International Conference on Cyber-Physical Systems (ICCPS 2010) · 2010
• paper A Unified Thermal-Computational Approach to Data Center Energy Management · Workshop on Feedback Control Implementation and Design in Computing Systems and Networks (FeBID 2009) · 2009
• paper Reducing Data Center Energy Consumption via Coordinated Cooling and Load Management · USENIX Workshop on Power Aware Computing and Systems (HotPower 2008) · 2008